Principal HBM Design Architect
Company: Micron Technology
Location: Richardson
Posted on: March 13, 2026
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Job Description:
Micron Technology is a world leader in innovating memory and
storage solutions that accelerate the transformation of information
into intelligence, inspiring the world to learn, communicate and
advance faster than ever. For more than 43 years, Micron Technology
has developed world?leading memory and semiconductor solutions. As
an HBM Memory Design Engineer on the HBM Architecture Team, you
will craft, simulate, optimize, and floorplan digital and analog
DRAM circuits used in advanced HBM products. You will evaluate
block?level and full?chip functionality, propose solutions to
ensure functionally accurate design, and work within a highly
innovative team developing next?generation high?bandwidth memory.
Micron’s HBM DEG integrates front?end and backend technologies,
TSV?based 3D stacking, custom gate?level and mixed-signal circuits,
and large?scale verification to deliver low?power, high?performance
solutions for ML and AI applications. This role provides the
opportunity to grow within a diverse, collaborative, distributed
team while contributing to the development of sophisticated HBM
products. Responsibilities • Design, simulate, and optimize DRAM
memory array, data path, ECC, command/control, and high?speed
interface circuits • Evaluate block?level and full?chip
functionality and propose solutions to ensure functional
correctness • Analyze timing, area, power, and complexity
trade?offs in high?speed DRAM or mixed?signal circuits • Perform
pathfinding and feasibility studies to explore new architectures
for future HBM products • Contribute to the design, layout, and
optimization of memory, logic, and analog circuits • Support
verification, debug, and validation activities for large?scale HBM
designs • Work collaboratively across engineering teams involved in
vertical integration and TSV?based stacking • Participate in design
reviews and continuous improvement of design methodologies Minimum
Qualifications • BSEE with 7 years, or MSEE with 5 years of
relevant engineering experience • Extensive knowledge of CMOS
circuit design and device physics • Experience with schematic entry
and simulation using FineSim, HSPICE, or equivalent tools •
Experience with power network analysis • Proficiency with scripting
languages such as Python, Tcl, or Perl Preferred Qualifications •
Familiarity with memory design • Strong analytical and
problem?solving skills • Effective communication skills and an
innovative mindset open to improving processes and products As a
world leader in the semiconductor industry, Micron is dedicated to
your personal wellbeing and professional growth. Micron benefits
are designed to help you stay well, provide peace of mind and help
you prepare for the future. We offer a choice of medical, dental
and vision plans in all locations enabling team members to select
the plans that best meet their family healthcare needs and budget.
Micron also provides benefit programs that help protect your income
if you are unable to work due to illness or injury, and paid family
leave. Additionally, Micron benefits include a robust paid time-off
program and paid holidays.
Keywords: Micron Technology, Haltom City , Principal HBM Design Architect, Engineering , Richardson, Texas
